Hotmelt TechnologyLow-pressure molds in the space of seconds make hot-melt technology viable for pressure- and heat-sensitive components, among others. Comparatively low equipment costs even make the production of small quantities feasible. This process, along with metal extrusion coating or cable extrusion, offers particularly strong protection of electronic and other components.
Berlet Formenbau GmbH & Co. KGManager Thomas Berlet
Am Hegelesberg 2
Fon + 49 (0)7021-86021-0
Fax + 49 (0)7021-86021-21